| 摘要 |
PURPOSE:To manufacture a highly accurate and fine wiring board whose connection reliability is excellent by removing a soot-like smear which has adhered in a hole working operation by means of an excimer laser. CONSTITUTION:A wiring part is worked, by means of a subtraction method, on a copper foil on one side of a two-layer metal-clad film which is constituted of a polyimide film 1 and the copper foil 2. A prescribed wiring pattern 3 is formed. The face of the polyimide film 1 is irradiated with an excimer laser; a non-through hole 4 which reaches the copper foil 2 in the wiring pattern 3 is formed. A low-temperature plasma treatment which uses a mixed gas of oxygen gas and a gas containing fluorine is executed; a soot-like smear 5 which has adhered to the peripheral part of the worked hole is removed. A titanium layer 6 and a copper layer 7 are formed continuously on the face of the polyimide including the inside of the non-through hole 4. A plated resist is formed; a wiring pattern 8 is formed by a copper sulfate plating operation; the plated resist is removed; after that, the copper layer 7 and the titanium layer 6 in parts where the wiring pattern 3 is not formed are removed. |
