| 摘要 |
<p>PURPOSE:To prevent mount-only terminal from making a contact or lease with another part by confining a cutout tip of a mount-only terminal inside to mold a secondary molded product. CONSTITUTION:First, after a light emitting chip and a light receiving chip are die-bonded to lead frames 11, 13, respectively, bonding wires are connected. Next, the light emitting side and the light receiving side of the lead frames 11, 13 are welded to die-mold a primary molded product. Thereafter, as thick burrs and thin burrs are removed, a mount-only terminal 22 is cut in a vicinity of the outer periphery of the primary molded product 15: at this time, cut positions are prevented from shifting outside the forming region of a secondary molded product 16. Then, the secondary molded product 16 is formed with the result that the mount-only terminal 22 are completely confined in the secondary molded product 16, when the mount-only terminal 22 can be prevented from protruding between lead-out terminals 21c, 21d, so that the creeping distance between the lead-out terminals 21c, 21d can be secured. Finally, lead forming is made.</p> |
