| 摘要 |
<p>PURPOSE: To mount semiconductor chips of various sizes, to enhance the reliability of a semiconductor package, and to reduce work necessary for developing and producing the semiconductor package. CONSTITUTION: A semiconductor chip is mounted on the top face, and there are provided an adhesive tape 22, a bus bar comprising two or more supporting parts, a group 26 of inner leads, an insulating layer 27, bonding pads, and wires 28. With this construction, it is unnecessary to separately form a lead frame but it is sufficient merely to use the adhesive tape, so that the reliability of the semiconductor package can be enhanced and the work necessary for the development and production can be reduced. By setting the lengths of wires connecting the semiconductor chip and the inner leads to be constant, the reliability of the semiconductor package can be enhanced, and the life of the wire bonding equipment can be improved.</p> |
