| 摘要 |
PURPOSE:To increase adhesion strength between a film wire and an inner lead by making rough the surface of an inner lead of a metal conductor for forming a dull part. CONSTITUTION:A chip 23 is mounted on a stage 22 which is formed at a lead frame 21 which is a metal conductor and bonding is performed by a film wire 25 between a pad which is formed on the chip 23 and an inner lead 24. In this case a roughly machined dull part 24a is formed on the surface of the inner lead 24, thus eliminating the film so that the film wire 25 is cut by a rough surface of the dull part 24a of the inner lead 24 when performing a second bonding by the film wire 25. Therefore, adhesion is performed for striking through the surface of the inner lead 24 and adhesion strength is increased, thus preventing a wire from being released on transportation and molding. |
