发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF PHOTOSENSITIVE ELEMENT AND PLATING RESIST USING THAT
摘要 PURPOSE:To provide a photosensitive resin compsn. with which a photosensitive element and a resist having both alkali developing property and resistance to electroless copper plating and having excellent flexibility can be obtd. CONSTITUTION:This photosensitive resin compsn. consists of a polyhydroxyether resin compd., acid anhydride-modified epoxyacrylate compd., photopolymerizable unsatd. compd. containing two or more end ethylene groups, and photopolymn. initiator. The polyhydroxyether resin compd. is obtd. by adding ethylene oxide or propylene oxide to hydroxyl groups of a polyhydroxyether resin compd. having a unit expressed by formula, then effecting the reaction with basic acid anhydride, and allowing the product to react with (meth)acrylic acid glycidyl ester. The photosensitive element and the plating resist are produced by using this resin compsn. In formula, R2 and R3 are alkyl groups, alkoxy groups or halogens, and x and y are independently integers 0-4.
申请公布号 JPH05281733(A) 申请公布日期 1993.10.29
申请号 JP19920082569 申请日期 1992.04.06
申请人 发明人
分类号 C08F299/02;C08F290/00;G03F7/027;G03F7/028;G03F7/032;G03F7/038;H01L21/027;H05K3/06;(IPC1-7):G03F7/032 主分类号 C08F299/02
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