发明名称 ETCHING SOLUTION
摘要 PURPOSE:To etch GaAs and ZnSe layers selectively by using an aqueous solution of hydrogen chloride and hydrogen peroxide. CONSTITUTION:A structure of epitaxial ZnSe layers 2 and epitaxial GaSa layers 3 is covered with an etching mask 5, and it is immersed in aqueous solution of hydrogen chloride and hydrogen peroxide. As a result, the uncovered portions are etched, and the etch rate decreases at the border of the GaAs layer 3. If the thickness of the ZnSe layer 2 is known beforehand, a predetermined process can be carried out by taking the structure out of the solution when the border of the epitaxial layer 3 is reached. Accordingly, the ZnSe layer can be etched selectively from the GaAs layer.
申请公布号 JPH05283398(A) 申请公布日期 1993.10.29
申请号 JP19920076863 申请日期 1992.03.31
申请人 发明人
分类号 H01L21/308;H01L33/28;H01L33/30 主分类号 H01L21/308
代理机构 代理人
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