| 摘要 |
<p>PURPOSE:To provide well-ordered leads having high size accuracy to realize easily mounting on a substrate by bending a part of leads guided to the outside of resin in the shape of gull-wing and then mutually fixing the leads at the flat portion in the resin side with an insulating support member. CONSTITUTION:A package 1 sealing an internally bonded semiconductor chip with a resin and leads 2 guiding respective functions of semiconductor chip to the outside are provided and the leads 2 are bent in the shape of gull-wing. An insulating support member 3 is fixed to the leads 2 so that the leads 2 are not deformed. The flat portions of the leads closer to resin side than the soldering part at the bottom portion of the leads 2 being bent are mutually fixed by the insulating support member 3. Thereby, the leads 2 can possibly be protected from deformation in the manufacturing stage and bending and short circuit of leads 2 cannot be generated at the time of soldering during the mounting.</p> |
