| 摘要 |
PURPOSE:To provide the title semiconductor device optimum for ultra-rapid operation by devising the highly reliable mounting technology in low development factor of defectives while making the ultra-rapid actuation and fixing of the potential of one surface of a semiconductor pellet consistent. CONSTITUTION:An ohmic electrode 4 is provided on one surface of a compound semiconductor pellet 1 fitted on a pellet fitting substrate 3 using CCB bumps 2 so as to connect a wiring on the substrate 3 to the ohmic electrode 4 by a bonding wire 10. Through these procedures, the ultra-rapid operation and the fixing of the potential of one surface of the semiconductor pellet 1 can be made consistent with each other so that the highly reliable mounting technology in low development factor of defectives may be devised thereby enabling the title semiconductor device optimum for ultra-rapid operation to be provided.
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