| 摘要 |
<p>PURPOSE:To improve sensitivity of a solid state image pickup by enhancing condensing characteristics of the pickup. CONSTITUTION:A plurality of photodetectors 12 provided on a semiconductor substrate 11 are covered with insulating films 13. Optical transmission lines 17 formed of reflecting surfaces 14 for condensing incident lights 71 to the photodetectors 12 and a light transmission medium (e.g. a light transmission film 16) surrounded at a side periphery with the surfaces 14 are formed on the films 13 on the respective photodetectors 12, Or, the plurality of photodetectors 12 provided on the substrate 11 are covered with the film 13, and condensing lenses (not shown) are provided on the upper surfaces of the films 13 on the photodetectors 12 in an on-chip structure, and the lines 17 are provided on the films 13 between the lens and the phothodetectors 12.</p> |
