| 摘要 |
PURPOSE:To enable electrical contact between an electrical connection electrode pad and an inner lead without re-designing an internal circuit of a semiconductor chip by establishing an electrical connection between the inner lead and the pad by means of an interconnection circuit substrate. CONSTITUTION:A plurality of bonding wires 26 connect conductive electrode pads 22 to inner leads 25 that are adjacent to the pads. An electrical connection pattern 27 is provided on the top of an interconnection circuit substrate 23. This pattern electrically connects an electrical connection electrode pad, i.e., a first electrical connection electrode pad 28a with a second electrical connection electrode pad 28b connected to the pattern 27. Thereby, it is possible to establish an electrical connection between a desired inner lead and a desired electrical connection electrode pad on a chip by means of the circuit substrate, and to enable electrical contact between an electrical connection electrode pad and an inner lead without re-designing an inner circuit of a semiconductor pattern. |
