VACUUM CHUCK FOR WAFER AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME

摘要

PURPOSE:To provide a wafer vacuum chuck which makes it unnecessary to suck a wafer more than once and a method for the manufacture of a semiconductor device using the chuck. CONSTITUTION:A wafer vacuum chuck 1 holds a wafer 10 on its suction face 2 by discharging air through an exhaust port 3. Between suction ports 21 and the exhaust port 3 provided is a check valve 23 which allows only air flowing from the suction ports 21 to the exhaust port 3 to pass through. Moreover, a vacuum chamber 24 is provided between the suction ports 21 and the check valve 23. A second check valve and an internal negative pressure source are provided in parallel with the first check valve 23. A wafer 10 is secured on the wafer vacuum chuck 1 using the internal negative pressure source only.