| 摘要 |
PURPOSE:To obtain a resin sealed type semiconductor device which can suppress the occurrence of package cracks in the surface mounting process, etc., is high in moisture resisting reliability, and can easily cope with size enlargement and thickness reduction. CONSTITUTION:In the title semiconductor device, a semiconductor element 3 is sealed with a sealing insulator 8 composed of a perforated metallic layer 7 and resin layers 6 formed on both surfaces of the layer 7. The resin used for the layers 6 constituting the insulator 8 must have a large electric insulation resistance, low hygroscopic property, and high heat resistance, strength, and adhesive property in order to secure the reliability of the resin sealed semiconductor device. In addition, for example, both active and inactive surface sides of the wire-bonding type semiconductor element 3 are sealed with the insulator 8 composed of the metallic layer 7 and sealing resin layers 6 formed on both surfaces of the layer 7. |
