发明名称 NEGATIVE PHOTOSENSITIVE ELECTRODEPOSITION COATING RESIN COMPOSITION, ELECTRODEPOSITION COATING BATH USING THAT AND MANUFACTURE OF RESIST PATTERN
摘要 PURPOSE:To provide an electrodeposition coating bath having good electrodeposition property by using a negative electrodeposition coating resin compsn. containing a specified component, and to provide a resist pattern of high resolution without incomplete development by using this bath. CONSTITUTION:This electrodeposition coating resin compsn. consists of polymers, nonwater-soluble monomers having two or more photopolymerizable unsatd. bonds in the molecule, nonwater-soluble photopolymn. initiator, and compd. expressed by formula I or II. The polymers are prepared by neutralizing polymers having 20-300 acid value obtd. by copolymn. of acrylic acids and/or methacrylic acids with a basic org. compd. In formulae I and II, R1 is a hydrogen atom, halogen atom, hydroxyl group, alkyl group, or alkoxyl group, R2 and R4 are hydrogen atoms, hydroxyl groups, alkyl groups, phenyl groups, etc., Y is a sulfonic acid group or its salt, and (n) is an integer 1-3. An electrodeposition coating film is formed on a conductive base body in an electrodeposition coating bath made of this resin compsn. The coating film is then exposed and developed to obtain a resist pattern.
申请公布号 JPH05281736(A) 申请公布日期 1993.10.29
申请号 JP19920079778 申请日期 1992.04.01
申请人 发明人
分类号 C25D13/06;C09D5/44;G03F7/004;G03F7/027;G03F7/028;G03F7/038;H01L21/027;H05K3/00;(IPC1-7):G03F7/038 主分类号 C25D13/06
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