| 摘要 |
<p>PURPOSE:To provide a semiconductor integrated circuit device that effects higher-density packaging and a method for constituting a faster computer system by overcoming several shortcomings of a conventional module packaging technique in computer packaging techniques. CONSTITUTION:A number of LSI chips, for example, six LSI chips 2a-2f are mounted on one large-sized LSI 1 in which substantially as many circuit elements as the LSI chips 2a-2f are integrated together. Each of the LSI chips 2a-2f is connected to the LSI via a logic circuit disposed in the LSI 1. When a computer system is configured, a number of LSI chips that form a number of instruction processing units are mounted on the main surface of a large-sized LSI that forms an arbitration circuit, a cache directory storage and the like of a system control unit. An LSI chip that forms a cache storage device is also mounted on the surface, and they are electrically connected with each other. Thereby, it is possible to reduce the size of a large-scale system, and also to execute an access to a system control unit from an instruction processing unit at high speed.</p> |
