| 摘要 |
PURPOSE:To integrate an electrical circuit consisting of conductive patterns and a photoconductor path consisting of an optical fiber with a printed circuit board by a plating transfer method. CONSTITUTION:The optical fiber 4 is inserted into the aperture of the prescribed pattern formed by removing the photoresist layer 3 on thin-film copper 2 formed on the surface of a conductor plate 1 and a non-light transparent curing resin 5 is packed into this aperture to fix the optical fiber. A copper plating layer 6 is formed in the apertures exclusive of the aperture inserted with the optical fiber and after the photoresist layer is removed, the optical fiber and the copper plating layer are transferred together with the thin-film copper by a plating transfer method to a non-curable epoxy resin layer and finally, the conductor plate and the thin-film copper are removed. |
