| 摘要 |
PURPOSE:To avoid the addition of excessive input capacity by a circuit needless for the circuit actuation by a method wherein multiple inner circuits are provided with respectively independent bonding pads while the space between said bonding pads and an outer pin can be selectively bonded. CONSTITUTION:The title semiconductor device is provided with multiple inner circuits 1, 2 required of selective connection to at least one outer terminal 9 by performing the bonding optional function and the functional transfer performing the same function. Within said semiconductor device, said multiple inner circuits 1, 2 are provided with respectively independent bonding pads 5, 6 while the space between said bonding pads 5, 6 and the outer pin 9 can be selectively bonded. For example, within a DRAM capable of bonding optionally transfer X1 to X4, in the case of X1, the bonding pad 5 connected to the input circuit 1 is to be connected to the outer pin 9 (lead frame). |
