| 摘要 |
PURPOSE:To form an excellent wire loop which is hardly affected by an external force and to prevent the occurrence of a curl by obliquely moving a capillary from a position on this side of a second bonding section toward the second bonding section and connecting a wire at the extended end of the oblique movement. CONSTITUTION:A first bonding section 4 is electrically connected to a second bonding section by using a capillary 1 holding a wire. In such wire bonding method, the capillary 1 is moved toward the second bonding section after the wire is connected to the section 4. Then the capillary 1 is obliquely moved from a position D on this side of the second bonding section toward the second bonding section and the wire is connected to the second bonding section at the extended end of the oblique movement. For example, the electrode 4 of a semiconductor pellet 5 can be regarded as the first bonding section 4 and a bonding point of a lead 3 can be regarded as the second bonding section. |
