| 摘要 |
2133740 9321260 PCTABS00027 Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboard, oriented strandboard, particleboard, wallboard and molded products were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives.
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