Device for dressing the cutting edge of a cutting-off tool for severing slices from an ingot or block-like workpiece, especially semiconductor material, use and sewing method for the same.
摘要
申请公布号
EP0432637(B1)
申请公布日期
1993.10.27
申请号
EP19900123400
申请日期
1990.12.06
申请人
WACKER-CHEMITRONIC GESELLSCHAFT FUER ELEKTRONIK-GRUNDSTOFFE MBH
