Integrated circuit package.

摘要

An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings (26 and 27, being the ground and the power wirings) and signal transmitting wirings (3) are disposed on entirely separate surfaces transmission wiring being on the surface of plate 1 and ground and power wirings being respectively on the surfaces 5 and 6 of plates 2 and 18 the power transmitting wirings being formed on entire peripheries (5 and 6) of respective, dedicated ceramic plates (2 and 18). Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.