Multi layered wiring board and method for manufacturing the same.

摘要

A multilayered wiring board having a multilayered wiring structure. A first meshed wiring layer having a plurality of holes formed therein and a second wiring layer having a plurality of wirings are provided. The wirings of the second wiring layer wind up and down so as to partially sink in the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding into spaces between the adjacent ones of the wirings of the second wiring layer. The crosstalks between the wirings are reduced.