| 摘要 |
PURPOSE:To remove pressure sensitive adhesives adhering on the surface of a wafer through one process without a danger having an adverse effect on the human body by applying water-growth pressure sensitive adhesives onto the surface of a base material as a pressure sensitive adhesive layer. CONSTITUTION:Water-growth pressure sensitive adhesives are applied onto the surface of a base material 2 as a pressure sensitive adhesive layer 3. Pres sure sensitive adhesives, in which copolymers are mutually entangled and cross- linked and swollen finitely when they are brought into contact with water in a copolymer using a monomer such as a monomer containing an unsaturated carboxylic acid and a monomer such as an acrylic acid ester group monomer as units, are employed as the water-growth pressure sensitive adhesives. When a release sheet 4 is fitted, the sheet 4 is removed, and a wafer A, the rear of which must be polished and treated, is stuck onto the pressure sensitive adhesive layer 3. The wafer is stuck onto the pressure sensitive adhesive layer 3 so that the surface of the wafer to which a pattern 5 is shaped is brought into contact at that time. Since adhering pressure sensitive adhesives B have sufficient water-solubility, the adhering pressure sensitive adhesives can be easily washed away. |
