| 摘要 |
PURPOSE:To obtain a mold which is used for molding a transparent resin with a semiconductor device sealed and from which a molded piece can be ejected to be released while a light-transmission window surface is prevented from being rubbed with the mold and kept in a mirror-surface state. CONSTITUTION:An object to be molded is a transparent resin-sealed semiconductor device provided with a light-transmission window part formed on the front surface of a transparent resin package 3 of a rectangular parallelopiped shape vertically to an optical axis and a sealed semiconductor laser device 1 loaded on a lead frame 2. In a force 5 (a cavity block 5a), a cavity surface 5d corresponding to the light-transmission window part has a draft of an angle of thetadegrees. On the basis of the cavity surface 5d, a butt surface between cavity blocks 5c and 6c for clamping the lead frame 2 is set to be vertical to the cavity surface 5d. When the molded piece is released from the mold by operating surface is prevented from being light-transmission window surface is prevented from being rubbed with the mold and roughened. |
