发明名称 |
Ceramic package for memory semiconductor |
摘要 |
A ceramic package for a memory semiconductor accommodates therein the memory semiconductor and is sealingly closed by an ultraviolet ray transmissible ceramic lid. The ceramic lid is made of a polycrystalline alumina and formed with at least one groove in a sealing portion with the ceramic package. With the arrangement, the ceramic package is superior in sealing strength, air-tightness and ultraviolet ray transmission and can easily accommodate any increase of memory amount of semiconductor elements.
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申请公布号 |
US5256901(A) |
申请公布日期 |
1993.10.26 |
申请号 |
US19920915404 |
申请日期 |
1992.07.20 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
OHASHI, TOSHIO;WAKAYAMA, MASAKI |
分类号 |
G11C5/00;(IPC1-7):H01L39/02;H01L23/28;H01L23/02 |
主分类号 |
G11C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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