发明名称 Advanced thermoelectric heating and cooling system
摘要 A thermoelectric heating and cooling system which includes a load plate, one or more thermoelectric devices and a heat sink. The load plate includes a housing having a hollow cavity filled with a fluid which changes temperature slower than the load plate housing to thereby act as a sustaining phase change reservoir to help maintain the desired temperature on the load plate. Each thermoelectric device is separated from the heat sink by a spacer formed of material having high thermal conductivity. The spacers, in conjunction with material having low thermal conductivity which separates the load plate from the heat sink, forms a spacer duct for the passage of fluid between the load plate and the heat sink and around the spacers. A housing surrounds the exterior surfacer of the heat sink to form a heat sink duct for channeling fluid across the fins provided on the heat sink. The heat sink duct and the spacer duct are interconnected, whereby a single fan can force fluid through both. The system also includes a load plate duct which is interconnected with the heat sink duct and, hence, the spacer duct.
申请公布号 US5255520(A) 申请公布日期 1993.10.26
申请号 US19910811325 申请日期 1991.12.20
申请人 REFIR TECHNOLOGIES 发明人 O'GEARY, DANIEL R.;ARNOLD, LARRY D.
分类号 F25B21/02;(IPC1-7):F25B21/02 主分类号 F25B21/02
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