| 摘要 |
PURPOSE:To correct the warping of a thin substrate by varying the relative speed between a sliding shoe and a ring bearing and also floating gap, and controlling the position of an upper surface plate. CONSTITUTION:Substrates 13 to be corrected are inserted into a carrier 14, and an upper surface plate 11 is placed. Before the warping correction, a micrometer head 16 is set, and a stationary gap is provided between a sliding shoe 17 and a ring bearing 18. Then, the ring bearing 18 is rotated through a driving gear 20, and a floating gap is formed. Thereafter, the number of rotation of the ring bearing 18 is slowly decreased, the floating gap is gradually reduced by applying small pressure so as not to yield elastic deformation in the thin substrates 13 to be corrected, thereby the warping is corrected. |
