| 摘要 |
PURPOSE:To improve mounting density, to shorten the line length of an electric wiring, to cut down the period of propagation of a signal, and to accomplish high-speed operation of a multichip. CONSTITUTION:In a multichip module which is formed by housing a plurality of semiconductor chips 4 and electrically connected to an electrically insulated substrate 1 having prescribed electric wiring pattern 2, a multistage-formed recessed part is formed on the electrically insulted a substrate 1, and each semiconductor chip 4 are housed in the recessed part in such a manner that they are separated with each other in vertical direction. |
