| 摘要 |
<p>PURPOSE:To prevent flux from adhering on an adjustment film by coating the face of overlapping of a board and a lower face terminal plate with a surface-inactive agent annularly around the axis of the pivot. CONSTITUTION:Nearly the center of a board 2 is pierced by a throughhole 3 opening both faces upper and lower, and the upper face of the board 2 is formed by coating with a resistor film 4 in U shape in plane view so as to surround the throughhole 3. The outer peripheral face of a pivot 6 of a face of overlapping of a lower face terminal plate 5 and the inner peripheral face of the throughhole 3 of a face of overlapping of the board 2 with the lower face terminal plate 5 are coated with a surface-inactive agent 12 before assembly of a chip variable resistor. This process can prevent outflow flux from adhering on the resistor film 4 as an adjustment film when the chip variable resistor is soldered to the board 2.</p> |
