发明名称 MANUFACTURE OF ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To improve a method of manufacturing an electronic component, such as double heat sink diode, with a pellet pinched by one pair of slug parts, which are fitted externally by a glass sleeve, from both sides of the pellet, in concrete terms, to make it possible to remove reliably glass powder, glass pieces or the like fallen on the slug parts in the glass sleeve. CONSTITUTION:A lead 1 led out from slug parts 2 is suspended from a plate 11 and after a glass sleeve 4 is fitted externally on the slug parts 2 on the plate 11 or after a pellet 3 is supplied on the slug parts 2 in the glass sleeve 4, a charged sheet 13 is made to approach the sleeve 4.</p>
申请公布号 JPH05275555(A) 申请公布日期 1993.10.22
申请号 JP19920070530 申请日期 1992.03.27
申请人 发明人
分类号 H01L23/08;(IPC1-7):H01L23/08 主分类号 H01L23/08
代理机构 代理人
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