| 摘要 |
PURPOSE:To prevent the stripping off of a bonding wire by constituting a bonding pad in a two-layer structure. CONSTITUTION:After forming an aluminum-silicon electrode layer 17 on a semiconductor substrate 12, a pure aluminum electrode layer 19 is formed on the layer 17 as a bonding pad. Then bonding wires 21 are bonded to the surface of the layer 19 by the ultrasonic wire bonding method. |
