| 摘要 |
PURPOSE:To obtain a method for manufacturing a multilayer circuit board in which adhesion defect of an inner layer circuit board and an adhesive insulating layer can be prevented and treating solution in the course of manufacturing scarcely remains on the boundary between the circuit board and the insulating layer. CONSTITUTION:When a copper foil of an inner layer circuit board is patterned to form an interconnection layer 1 and a plurality of the boards are laminated through an adhesive insulating layer to manufacture a multilayer circuit board, the foil is previously surface treated by using aqueous solution containing cupric sulfate and sodium chloride. Since the surface of the foil is roughed by this treatment, adhesive strength of the layer 1 formed of the foil and the surface of the layer 1 is formed of sole metal copper or metal copper covered with Cu2O to improve its acid resistance. Accordingly, even if the surface of the layer 1 is brought into contact with acid treating agent in the course of manufacturing the multilayer circuit board, it is not dissolved, and hence adhesion defect of the inner layer circuit board and the insulating layer can be prevented and treating solution in the course of manufacturing does not remain on their boundary, etc. |
