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发明名称
SEMICONDUCTOR SEALING RESIN COMPOSITION
摘要
申请公布号
JPH05275572(A)
申请公布日期
1993.10.22
申请号
JP19920098541
申请日期
1992.03.26
申请人
发明人
分类号
C08G59/18;H01L23/29;H01L23/31;(IPC1-7):H01L23/29
主分类号
C08G59/18
代理机构
代理人
主权项
地址
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