| 摘要 |
PURPOSE:To obtain a excellent electroless plating solution resistance and adhesive strength to a substrate or copper by incorporating a specific compound, a photopolymerization initiator, an epoxy hardener, a hydrophobic silica particulate and a specific polymer. CONSTITUTION:The compound obtained by allowing 1 equivalent epoxy group of a compound having two or more epoxy group in the molecule to react with 0.2-0.8 equivalent unsaturated carboxylic acid, the compound having two or more ethylenic unsaturated bond in the molecule, the photopolymerization initiator, the epoxy hardener, the hydrophobic silica particulate and the polymer containing the repeating unit expressed by the formula and having 1000-300000 weight average molecular weight are contained. In the formula, R<1> is hydrogen or 1-3C alkyl group, R<2> is hydrogen 1-6C alkyl group or 1-6C hydroxy alkyl group. In this case, the compound obtained by allowing unsaturated carboxylic acid to react is hardened by irradiating with active energy beam and causes cross-linking reaction by heating to form tight bond. |
