| 摘要 |
The process involves forming, on a printed circuit board, holes for electrical connection with components on the other side of the board, and preparing metallic surfaces to receive the components. Solder is placed on the second face relative to metallic surfaces and to the holes. The principal of capillarity is used to cross the holes with the solder to link to top and lower (20) surfaces. The printed circuit board (10) is double faced and made of insulating material (12). Metallic holes (14) are made in the second surface of the board and electrical conductors (22) are connected to the holes. Components are connected to the metallic arcs and are related/connected to components on the other side of the board. USE - Fabrication of two-sided printed circuit boards.
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