| 摘要 |
PURPOSE:To obtain the method which can excellently measure the shape of solder. CONSTITUTION:A starting position S of laser light L is set at the central part C of an upper surface 2a of a lead. The laser light L is made to scan in the direction N1 directed toward the side of a light receiving part 6 from a laser emitting device 5. The edge E of the lead 2 on the side of the light receiving part 6 is detected. An offset point B is set between the edge E and the center A of the lead 2. The laser light L is made to scan in the direction N2 of the length of the lead 2 passing the offset point B. Thus, the shape of solder 3, which is bonded to the tip part of the lead 2, is measured. The laser light is not cast in the vicinity of the edge of the lead 2 at the opposite side of the light receiving part. The secondary reflection from a neighboring lead is avoided. Thus, the edge at the side of the light receiving part to be obtained can be readily detected. |
