| 摘要 |
PURPOSE:To realize a multilayer interconnection structure having high reliability by using polyimide generated through heating a specific polyimide precursor as surface protective coat, alpha-ray shielding film or wiring insulating film. CONSTITUTION:Polyimide generated through heating a polyimide precursor composed of cyclic units with molecular chains respectively represented by formulae I, II and III is used as surface protective coat, alpha-ray shielding film or wiring insulating film. This material is particularly excellent in low dielectric constant, low coefficient of thermal expansion, heat resistance and adhesive property. Thus, it is possible to obtain all sorts of electronic equipments including a semiconductor device and multilayer interconnection structure having high reliability and high performance. |
