| 发明名称 |
Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby. |
| 摘要 |
<p>A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.</p> |
| 申请公布号 |
EP0310803(B1) |
申请公布日期 |
1993.10.20 |
| 申请号 |
EP19880113776 |
申请日期 |
1988.08.24 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FOUST, DONALD FRANKLIN;DUMAS, WILLIAM VINCENT;LAMBY, EDWARD JOHN;KARAS, BRADLEY ROSS |
| 分类号 |
C23C18/40;C08J7/12;C09J5/02;C23C18/20;C23C18/26;H05K3/38;(IPC1-7):C23C18/18 |
主分类号 |
C23C18/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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