Method of producing boards for printed wiring.

摘要

A board for printed wiring is produced by disposing a metal foil (4) in a plate-shaped cavity (3) of a mold so that the metal foil (4) is in contact with at least one internal surface of the cavity (3), injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin. The molding material contains 50 to 90 % by volume of the powdery inorganic filler based on the total of the molding material. <IMAGE>