| 摘要 |
<p>PURPOSE:To enable the manufacture of an element having high function even with one chip and further, enable the multi-item small-quantity production of semiconductor devices by preventing the drop of the yield rate accompanying the increase of the area of a semiconductor chip. CONSTITUTION:After manufacture of a plurality of semiconductor chips 2 and 3, only the superior goods are selected, and the fellow side faces, where atoms are densest, of respective semiconductor substrates 9 are connected so that the element formation faces 4a and 4b may be on a level. Therefore, even if the area of a chip increases, the drop of yield rate can be prevented, so the manufacture of a one-chip element having high function with large area becomes possible. Moreover, multi-item small-quantity production becomes possible by preparing many kinds of semiconductor chips and connecting them, changing the combination.</p> |
