| 摘要 |
PURPOSE:To place a plurality of semiconductor elements each having a large flowing current inexpensively with high reliability. CONSTITUTION:A heat sink 11 is coated with an insulator 11, a lead frame 13 is fixed to the sink 11 via a fixing pin 14, and simultaneously an insulator 12 is fixed to the frame 13. Semiconductor elements 15 are placed on islands provided on the frame 13, wire bonded via fine metal wirings 16, and resin- molded by molding resin 17. |
