| 摘要 |
PURPOSE:To enhance size accuracy of a die island for a small package and evenness accuracy during its formation and reduce stress applied to the package during cutting by installing a projection to the cutting position at a bordering section of the package when a lead frame is clamped in a resin sealed mold. CONSTITUTION:A projection 2 is installed to the cutting position of a lead frame 4 to be cut at a bordering section of a package after it is resin-sealed. When an upper die 1 falls and the lead frame 4 is clamped with the upper die 1 and a lower die 5, the projection 2 installed to the upper die 1 allows a notch 7a to be formed at an accurate cutting position of a package in its bordering section. Since the notch 7a is always formed at the accurate cutting position of the package in the bordering section, the stress applied to the package during cutting time is reduced or relieved. In addition, since no notch is provided to the lead frame up to resin sealing, there is no possibility for cutting. |
