| 摘要 |
PURPOSE:To collect and store deficient functional chips in one package and improve the mounting density and reduce production cost by without mounting individual IC devices on ECL level or MOS level separately on a printed board or making the whole circuit of them into a composite circuit chip. CONSTITUTION:A level conversion circuit chip 11, which converts a signal between the logical signal S1 on voltage level concerned with low-impedance load and the logical signal S2 on voltage level concerned with high-impedance load, and a semiconductor integrated circuit chip 12, which processes each kind of signals, based on the logical signal S2 on voltage level concerned with the high impedance load the signal of which is converted and the logical signal S2 of voltage level concerned with the high impedance load being input from or output to outside, are accommodated in one package 13. |
