| 摘要 |
<p>PURPOSE:To miniaturize a package, reduce the rate of defective contact between bonding wires for interconnecting a lead and a semiconductor device. CONSTITUTION:A lead 11 is disposed up and down in a zigzag manner, and a distance between lower stage inner leads 13IN is more narrowed than the width of an upper stage inner lead 12IN. Further, the end position of the lower stage inner lead 13IN is located on a die pad 9 side more closely to the die pad 9 than the end position of the upper stage inner lead 12IN is.</p> |
