| 摘要 |
<p>PURPOSE:To improve heat dissipation properties when a cheap board material such as glass epoxy is employed in the board for multichip module. CONSTITUTION:Multiple through holes 4 are made at a part of a board 1 where a semiconductor chip 2 is mounted while a metal layer 5 or a heat sink 6 is provided on the main surface of the board 1 opposite to the main surface on which the semiconductor chip 2 is mounted thus ensuring a path for dissipating heat produced from the semiconductor chip 2. Since the heat produced from the semiconductor chip 2 can be dissipated through a metal, cheap board material such as glass epoxy can be employed. According to the constitution, heat dissipation properties superior to that of ceramic board can be achieved without causing cost increase due to formation of through hole 4 or filling of metal.</p> |
