| 摘要 |
PURPOSE:To prevent stress concentration by equalizing the thickness of a joint section between a semiconductor pallet and a mount section and provide a mounting structure for a semiconductor device having high strength against shearing stress accompanied by the heat generation of a pellet. CONSTITUTION:A semiconductor pellet 1 is bonded with a mounting section 101 with a brazing material 111. Fine particles (Cu ball) 112 comprising a higher melting point material are mixed with the brazing material 101. The fine particles are contained in the brazing material 101 at a specified rate before they are joined. When the brazing material is melt when they are joined, the fine particles function as a spacer, which makes it possible to equalize the thickness of a connection section between the mounting section 101 and the pellet 1. |
