发明名称 MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To efficiently manufacture a multilayer printed circuit board having a surface layer and a continuity only purpose hole for selectively connecting a circuit of an inner layer adjacent to the surface layer. CONSTITUTION:After a part of prepreg through holes previously provided at a predetermined interval at a prepreg 4 is heated, pressurized to be formed, an adhesive layer opening 9 is selectively formed by irradiating with a laser light. Further, after it is copper-plated 11, a circuit is formed, and via T/H 12 is obtained.
申请公布号 JPH05267853(A) 申请公布日期 1993.10.15
申请号 JP19920095793 申请日期 1992.03.23
申请人 发明人
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
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