摘要 |
PURPOSE:To efficiently manufacture a multilayer printed circuit board having a surface layer and a continuity only purpose hole for selectively connecting a circuit of an inner layer adjacent to the surface layer. CONSTITUTION:After a part of prepreg through holes previously provided at a predetermined interval at a prepreg 4 is heated, pressurized to be formed, an adhesive layer opening 9 is selectively formed by irradiating with a laser light. Further, after it is copper-plated 11, a circuit is formed, and via T/H 12 is obtained. |