| 摘要 |
PURPOSE:To provide the waveguide device which is small in size and has excellent connecting performance. CONSTITUTION:Fitting guide grooves 8 and clearance adjusting grooves 18 are formed as separate grooves on the surface of a semiconductor chip 15 formed with an optical waveguide 5 on the surface of a substrate 4. Clearance adjusting pins 17 are housed into the clearance adjusting grooves 18. Second grooves 21 are fitted to the upper side of the clearance adjusting pins 17 and a pin retaining cap plate 7 is applied thereon. The waveguide chip 15, the clearance adjusting pins 17 and the pin retaining cap plate 7 are integrated by adhesion, etc., by which the waveguide device 1 is formed. The size of the pin fitting holes 13 enclosed by the fitting guide grooves 8 and the first grooves 20 on the pin retaining cap plate 7 side is regulated by the diameter of the clearance adjusting pins 17. The attachment, detachment and connection of the waveguide device 1 and optical connectors 3a, 3b are executed by fitting the pin fitting holes 13 to the fitting pins 6 for positioning on the optical connectors 3a, 3b side with zero clearances. |
