| 摘要 |
<p>PURPOSE:To enable a wiring board to be mounted with a semiconductor element which deals with high frequency signals and operates at a high speed and to carry out the highly reliable communication of high frequency signals between wiring layers, where the wiring board is adequate to be mounted with an element (LSI, electronic component) suitable for processing high frequency signals or high speed signals. CONSTITUTION:A wiring board (correspondent to a double-side printed board) composed of an insulating board 1 and electrical conductor pattern wiring layers 2 and 3 formed on both the sides of the board 1 or insulating boards 41-44 provided with electrical conductor pattern wiring layers 45 and 46 formed on its both sides or single side each are laminated into a multilayer wiring board (corresponding to a multilayer printed wiring board), where a through-hole is provided adjacent to the electrical conductor pattern wiring layers so as to communicate high frequency signals between the wiring layers. Materials 4 and 47 higher than an insulating board in dielectric constant are provided inside the through-hole.</p> |
