发明名称 RADIATION SENSITIVE HIGH MOLECULAR COMPOUND
摘要 PURPOSE:To improve sensitivity, resolution and dry etching resistance, and make a baking process unnecessary after exposure by including the structures of a phenol hydroxyl group, a specified atomic group, and the like in a high molecular compound as essential components. CONSTITUTION:Two structures of a phenol hydroxyl group, an atomic group expressed by a formula or the salt of organic acid or inorganic acid thereof, and the like are included in a high molecular compound as essential components. In the formula R<1>, R<2> are a hydrogen atom or hydrocarbon having 1-4 of carbons, Ar is an aromatic ring which may be substituted by at least one selected from the group of alkyl, alkenyl, alkynyl, halogen substituted hydrocarbon, alkoxy, alkoxy carbonyl, carbamoyl, hydroxyl group, sulfo, nitro, amino, cyano, and halogen having 1-10 of carbons. Meanwhile a typical phenol hydroxyl group is a hydroxyphenyl group, a hydroxynaphthyl group, a hydroxy anthryl group, and the like are also typical ones.
申请公布号 JPH05265209(A) 申请公布日期 1993.10.15
申请号 JP19920063113 申请日期 1992.03.19
申请人 发明人
分类号 G03F7/038;C08F299/00;H01L21/027;(IPC1-7):G03F7/038 主分类号 G03F7/038
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