Heat sink for integrated circuit micro-chip thin film package - uses cooling plate with cooling channels open to membrane sealed to underside of plate inside facing IC micro-package

摘要

The heat sink comprises a common coupling plate (1) with cooling channels (8) for a heat transfer medium in contact with each of the micro-packages. The contact pressure is provided by a spring element between the package and the surface of the circuit board. The spider (4) providing the package outer leads attached to the circuit board solder pads are Z shaped to compensate path differences in the perpendicular direction. The cooling plate has a heat conductive membrane (2) sealed to its underside with the cooling channels being open on the membrane side. The membrane pref. has a thickness greater than 0.1 mm. ADVANTAGE - Simple mfr. of micro-packages and mounting on surface of circuit board with efficient removal of waste heat.